DocumentCode
605825
Title
Study of Single Event Upsets in different double gate FinFET based SRAM topologies
Author
Srikanth, K. ; Vinodhkumar, N. ; Nagarajan, K.K. ; Srinivasan, Rajagopalan
Author_Institution
ECE Dept., SSN Coll. of Eng., Chennai, India
fYear
2013
fDate
25-26 March 2013
Firstpage
260
Lastpage
264
Abstract
Soft errors also known as Single Event Upsets (SEU) is a term that defines the non-permanent errors caused in microelectronic circuits when high energy particles strike at the sensitive regions of the devices. In this paper, independently driven double gate (IDDG) FinFET and simultaneously driven double gate (SDDG) FinFET based 6T-SRAM cells are studied for their soft error performance. Ten different topologies, nine IDDG based topologies namely Flex-VTH, Flex PG, PG-SN, PG-OSN, Flex PD, Flex PU, Flex-cell, Flex PUPG, Flex PDPG and one SDDG based topology are studied to find out the minimum dose required to flip the value stored in the SRAM cell using TSPICE simulations with 45 nm PTM model. Flex-PG and PG-OSN are having better immunity to radiation and a critical dose value of 1.18 MeV-cm2/ mg.
Keywords
MOSFET; SPICE; SRAM chips; circuit simulation; network topology; radiation effects; 6T-SRAM cells; Flex PD topology; Flex PDPG topology; Flex PG topology; Flex PU topology; Flex PUPG topology; Flex-VTH topology; Flex-cell topology; IDDG FinFET; IDDG-based topologies; PG-OSN topology; PG-SN topology; PTM model; SDDG FinFET; SDDG-based topology; SEU; SRAM topologies; TSPICE simulations; independently driven double gate FinFET; microelectronic circuits; nonpermanent errors; radiation immunity; simultaneously driven double gate FinFET; single event upsets; size 45 nm; soft error performance; FinFETs; Flexible printed circuits; Integrated circuit modeling; Logic gates; Random access memory; Single event upsets; Topology; 6T SRAM; DG FinFET; SEU; TSPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Trends in Computing, Communication and Nanotechnology (ICE-CCN), 2013 International Conference on
Conference_Location
Tirunelveli
Print_ISBN
978-1-4673-5037-2
Type
conf
DOI
10.1109/ICE-CCN.2013.6528505
Filename
6528505
Link To Document