DocumentCode :
605876
Title :
Impact of device geometry and doping concentration variation on electrical characteristics of 22nm FinFET
Author :
Sivasankaran, K. ; Mallick, P.S. ; Chitroju, T.R.K.K.
Author_Institution :
Sch. of Electr. Eng., VIT Univ., Vellore, India
fYear :
2013
fDate :
25-26 March 2013
Firstpage :
528
Lastpage :
531
Abstract :
This paper presents the impact of device physical geometry and doping concentration variation on dc characteristics of 22nm FinFET. The device geometry such as thickness of fin (Tfin) and gate oxide thickness (tox) are varied and the performance such as threshold voltage (Vth), subthreshold swing (SS), on current (Ion), off current (Ioff) of FinFET are analyzed using TCAD. Also the impact of doping concentration on dc characteristics were studied. The results show that for Tfin of 3nm, tox of 1.5nm and fin height (Hfin) of 7nm has higher Ion and lower Ioff.
Keywords :
MOSFET; semiconductor doping; FinFET; TCAD; dc characteristics; device physical geometry; doping concentration variation; electrical characteristics; gate oxide thickness; size 22 nm; Doping; FinFETs; Logic gates; Performance evaluation; Semiconductor process modeling; Threshold voltage; FinFET; TCAD Simulation; Tri gate; device geometry; doping concentration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Trends in Computing, Communication and Nanotechnology (ICE-CCN), 2013 International Conference on
Conference_Location :
Tirunelveli
Print_ISBN :
978-1-4673-5037-2
Type :
conf
DOI :
10.1109/ICE-CCN.2013.6528556
Filename :
6528556
Link To Document :
بازگشت