Title :
Design and characterization of corporate feed rectangular microstrip patch array antenna
Author :
Subbulakshmi, P. ; Rajkumar, R.
Author_Institution :
Fac. of Eng., Dept. of Electron. & Commun. Eng., RVS, Coimbatore, India
Abstract :
The modern mobile communication systems requires high gain, large bandwidth and minimal size antenna´s that are capable of providing better performance over a wide range of frequency spectrum. This requirement leads to the design of Microstrip patch antenna. This paper proposes the design of 4-Element microstrip patch antenna array which uses the corporate feed technique for excitation. Low dielectric constant substrates are generally preferred for maximum radiation. Thus it prefers Taconic as a dielectric substrate. Desired patch antenna design is initially simulated by using high frequency simulation software SONNET and FEKO and patch antenna is designed as per requirements. Antenna dimensions such as Length (L), Width (W) and substrate Dielectric Constant (εr) and parameters like Return Loss, Gain and Impedance are calculated using high frequency simulation software. The antenna has been designed for the range 9-11 GHz. Hence this antenna is highly suitable for X-band applications.
Keywords :
antenna feeds; design; microstrip antenna arrays; substrates; FEKO; SONNET; Taconic substrate; X-band applications; antenna dimensions; corporate feed rectangular microstrip patch array antenna characterization; corporate feed rectangular microstrip patch array antenna design; corporate feed technique; dielectric constant substrates; dielectric substrate; four-element microstrip patch antenna array; frequency spectrum; high frequency simulation software; high gain antenna; large bandwidth antenna; maximum radiation; minimal size antenna; modern mobile communication systems; patch antenna design; substrate dielectric constant; Arrays; Feeds; Microstrip; Microstrip antenna arrays; Microstrip antennas; Patch antennas; Corporate Feed; Microstrip Patch Antenna; Patch Parameters; SONNET; Taconic substrate;
Conference_Titel :
Emerging Trends in Computing, Communication and Nanotechnology (ICE-CCN), 2013 International Conference on
Conference_Location :
Tirunelveli
Print_ISBN :
978-1-4673-5037-2
DOI :
10.1109/ICE-CCN.2013.6528560