DocumentCode :
60612
Title :
Sub-Torr Chip-Scale Sputter-Ion Pump Based on a Penning Cell Array Architecture
Author :
Green, Scott R. ; Malhotra, Ravish ; Gianchandani, Yogesh B.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
Volume :
22
Issue :
2
fYear :
2013
fDate :
Apr-13
Firstpage :
309
Lastpage :
317
Abstract :
This paper investigates a miniaturized, chip-scale Penning cell array for sputter-ion pumping. In a 2.5 cm3 package, a 0.2 cm3 pump architecture with 1.5 mm diameter cells in a 4 × 2 array reduces pressure from 1 Torr (133.3 Pa) to <; 200 mTorr (26.6 Pa) in about 10 h, and from 115 mTorr (15.3 Pa) to <; 10 mTorr (1.33 Pa) in 4 h. The rate of molecular removal in this range of pressures is 0.09 ×1013 to 1.17 ×1013 molecules/s. Experiments show that the architecture is capable of igniting and sustaining the plasma required for operating at a pressure at least as low as 1.5 μTorr (200 nPa). The advantage of the Penning cell architecture reported here in comparison to other chip-scale ion pump architectures is the drastically reduced operating pressures that can be achieved and maintained. The microdischarge requires 450-600 V applied across the device and consumes 100-250 mW. The Penning cell array architecture shows significant promise for power efficient high-vacuum pumping in chip-scale and smaller systems.
Keywords :
Penning discharges; chip scale packaging; ion pumps; micropumps; sputtering; chip-scale Penning cell array architecture; microdischarge; molecular removal rate; power 100 mW to 250 mW; power efficient high-vacuum pumping; size 1.5 mm; subtorr chip-scale sputter-ion pump architecture; time 4 h; voltage 450 V to 600 V; Anodes; Cathodes; Computer architecture; Microprocessors; Saturation magnetization; Titanium; Microplasma; micro-discharge; packaging; sputtering; vacuum;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2012.2221159
Filename :
6338261
Link To Document :
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