DocumentCode :
606842
Title :
Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength
Author :
Hartmann, Steve ; Holck, O. ; Wunderle, B.
Author_Institution :
Dept. Mater. & Reliability of Microsyst., Univ. of Technol., Chemnitz, Germany
fYear :
2013
fDate :
14-17 April 2013
Firstpage :
1
Lastpage :
8
Abstract :
CNT/metal interfaces under mechanical loads are investigated using molecular dynamics by simulating pull-out tests of single walled carbon nanotubes (CNTs) emdedded in single crystal gold lattices. As a result of our simulations we present obtained force-displacement data. We investigated the influence of two different Lennard Jones (LJ) coefficients pairs, two CNT types and three lattice directions of the gold matrix with respect to the embedding direction. Additionally we incorporated structural defects into our model and report on their influence. The change of the CNT type leads to a change in the maximum pull-out force. Here we attribute this to the change in CNT diameter, where a bigger diameter entails an increased maximum pull-out force. Changing the LJ coefficient pair has a strong impact on the maximum pull-out forces, where a higher bonding energy results in a higher maximum pull-out force. Defects also show a positive effect on the maximum pull-out force. The presented results have impact on bonding strength of CNT/metal interfaces.
Keywords :
bonding processes; carbon nanotubes; CNT diameter; CNT metal interface; CNT/gold interface; CNT/metal interface; LJ coefficient pair; Lennard Jones coefficient pairs; bonding strength; embedding direction; force displacement data; gold matrix; maximum pull out force; molecular dynamics simulation; pull out test; single crystal gold lattice; single walled carbon nanotubes; three lattice direction; Abstracts; Carbon; Force; Frequency modulation; Mechanical systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
Type :
conf
DOI :
10.1109/EuroSimE.2013.6529903
Filename :
6529903
Link To Document :
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