LED design optimization by means of virtual assembly process based on FEM simulation

Author

Watzke, S. ; Altieri-Weimar, P.

Author_Institution

Osram Opto Semicond. GmbH, Regensburg, Germany

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

7

Abstract

In this study the influence of assembly process steps on reliability behavior of Light Emitting Diodes (LED) products is investigated. A virtual assembly process is developed in Finite Element (FE) model and is validated using experimental results deriving from material characterization as well as robustness results of the LED products. Focus is set on delamination failures and the correlation between failure risk and variations of the assembly process. Additional environmental conditions such as temperature and moisture concentration are taken into account during the assembly process. The FE model gives insights into the relationship between the reliability of the virtual assembled product and the environmental conditions and offers the capability of LED design optimization to ensure the robustness of the products.

Keywords

assembling; finite element analysis; light emitting diodes; FE model; FEM simulation; LED design optimization; LED products; delamination failures; environmental condition; failure risk; finite element model; light emitting diodes products; material characterization; product robustness; reliability behavior; virtual assembled product; virtual assembly process; Abstracts; Assembly; Finite element analysis; Lead; Light emitting diodes; Materials; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529906

Filename

6529906