Impact of bosch scallops dimensions on stress of an open through Silicon Via technology

Author

Singulani, A.P. ; Ceric, H. ; Filipovic, Lado ; Langer, E.

Author_Institution

Christian Doppler Lab. for Reliability Issues in Microelectron. at Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

6

Abstract

The through Silicon Via (TSV) is a lead topic in interconnects and 3D integration research, mainly due to numerous anticipated advantages. However, several challenges must still be overcome if large scale production is to be achieved. In this work, we have studied the effects of Bosch scallops concerning mechanical reliability for a specific TSV technology. The presence of scallops on the TSV wall modifies the stress distribution along the via. By means of Finite Element Method (FEM) simulations, we assess this change in order to better understand the process. The achieved results support experiments and give further insight into the influence of scallops on the stress in an open TSV.

Keywords

finite element analysis; integrated circuit reliability; large scale integration; three-dimensional integrated circuits; 3D integration research; Bosch Scallops dimensions; FEM simulations; TSV technology; finite element method simulations; large scale production; mechanical reliability; numerous anticipated advantages; open TSV; open through silicon via technology; stress distribution; Abstracts; Computational modeling; Metals; Scanning electron microscopy; Shape; Silicon; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529938

Filename

6529938