Title :
Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications
Author :
Yafan Zhang ; Belov, Ilja ; Sarius, N.G. ; Bakowski, Mietek ; Nee, Hans-Peter ; Leisner, Peter
Author_Institution :
Acreo Swedish ICT AB, Kista, Sweden
Abstract :
A thermal design of an integrated double-side cooled SiC 50kW-1200V-200A power inverter for hybrid electric vehicle applications has been proposed to enable cooling in two different automotive operating environments: under-hood and controlled temperature environment of passenger compartment. The power inverter is integrated with air/liquid cooled cold plates equipped with finned channels. Concept evaluation and CFD model calibration have been performed on a simplified thermal prototype. Computational experiments on the detailed model of the inverter, including packaging materials, have been performed for automotive industry defined application scenarios, including two extreme and one typical driving cycles. For the studied application scenarios the case temperature of the SiC transistors and diodes have been found to be below 210°C. The maximum steady-state temperature of the DC-link capacitor has been below 127 °C for the worst-case scenario including liquid cooling, and up to 140 °C for the worst-case scenario with air-cooling.
Keywords :
automotive electronics; computational fluid dynamics; cooling; hybrid electric vehicles; invertors; silicon compounds; wide band gap semiconductors; CFD model calibration; DC-link capacitor; SiC; air-liquid-cooled cold plates; automotive industry; automotive operating environments; computational experiment; controlled temperature environment; current 200 A; driving cycles; finned channels; hybrid electric vehicle application; integrated double-side cooled silicon carbide power inverter; liquid-air cooled integrated power inverter; maximum steady-state temperature; packaging materials; passenger compartment; power 50 kW; silicon carbide transistors; simplified thermal prototype; thermal design; thermal evaluation; underhood environment; voltage 1200 V; Abstracts; Capacitors; Conductivity; Green products; Reliability; Substrates; Thermal conductivity;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
DOI :
10.1109/EuroSimE.2013.6529944