Non-conforming meshes in multi-scale thermo-mechanical Finite Element Analysis of semiconductor power devices

A thermo-mechanical investigation of a Smart Power Switch using the Finite Element Method is presented. We consider a non-conforming discretization of the computational domain to bridge the scales. It allows a high degree of flexibility for discretizing the region where a fine mesh is required. We benchmark a simplified, Lagrange multiplier based displacement method in terms of accuracy and runtime. Compared to the widespread submodeling technique, it eliminates the need for elaborate homogenization methods. Results are shown for two and three-dimensional problems.