Transient thermal response as failure analytical tool - A comparison of different techniques

Author

May, Dominik ; Wunderle, B. ; Schacht, R. ; Michel, Bruno

Author_Institution

Tech. Univ. Chemnitz, Chemnitz, Germany

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

5

Abstract

New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.

Keywords

X-ray analysis; acoustic microscopy; cracks; failure analysis; integrated circuit reliability; stress analysis; system-in-package; three-dimensional integrated circuits; 3D integration; Joules heat source; SAM; SiP; X-ray analysis; crack tip; defect detection; die attach layer void; electrical short circuit; electronic device reliability; failure analytical tool; interface delamination; packaging technology; periodic changing stress field; scanning acoustic microscopy; system-in-package; transient thermal response method; Abstracts; Artificial intelligence; Compounds; Gold; Silicon; Size measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529959

Filename

6529959