Title :
Transient thermal response as failure analytical tool - A comparison of different techniques
Author :
May, Dominik ; Wunderle, B. ; Schacht, R. ; Michel, Bruno
Author_Institution :
Tech. Univ. Chemnitz, Chemnitz, Germany
Abstract :
New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.
Keywords :
X-ray analysis; acoustic microscopy; cracks; failure analysis; integrated circuit reliability; stress analysis; system-in-package; three-dimensional integrated circuits; 3D integration; Joules heat source; SAM; SiP; X-ray analysis; crack tip; defect detection; die attach layer void; electrical short circuit; electronic device reliability; failure analytical tool; interface delamination; packaging technology; periodic changing stress field; scanning acoustic microscopy; system-in-package; transient thermal response method; Abstracts; Artificial intelligence; Compounds; Gold; Silicon; Size measurement;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
DOI :
10.1109/EuroSimE.2013.6529959
