• DocumentCode
    607037
  • Title

    Preparation for embedded systems laboratories the virtual workspace approach

  • Author

    Buchner, Steffen ; Jaschke, Steffen

  • Author_Institution
    Didactics of Inf. & E-Learning, Univ. of Siegen, Siegen, Germany
  • fYear
    2013
  • fDate
    13-15 March 2013
  • Firstpage
    171
  • Lastpage
    175
  • Abstract
    In this paper, an innovative environment to foster students´ preparation for embedded systems laboratory is presented. A collection of tools is assembled into a virtual-machine-based environment on a USB flash drive to support the students work outside of the laboratory. Thus, students are enabled to develop applications without the corresponding hardware at a place and time of their choice. Targeted hardware platforms range from Atmel microcontrollers to Field Programmable Gate Arrays (FPGAs) and common Android smartphones. The laboratory, developed by the KOMINA project, represents the application area for our approach. It is accompanied by theoretical didactic research which focuses on higher education, too. The proposed approach is discussed in terms of benefits and limitations. An evaluation confirms the students´ satisfaction.
  • Keywords
    Linux; computer aided instruction; embedded systems; field programmable gate arrays; flash memories; further education; microcontrollers; smart phones; virtual instrumentation; virtual machines; Android smartphones; Atmel microcontrollers; FPGA; KOMINA project; USB flash drive; embedded system laboratories; field programmable gate arrays; higher education; student satisfaction; virtual machine-based environment; virtual workspace approach; Ash; Embedded systems; Field programmable gate arrays; Laboratories; Universal Serial Bus; Virtual machining; Distance learning; Embedded software; Laboratories;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Engineering Education Conference (EDUCON), 2013 IEEE
  • Conference_Location
    Berlin
  • ISSN
    2165-9559
  • Print_ISBN
    978-1-4673-6111-8
  • Electronic_ISBN
    2165-9559
  • Type

    conf

  • DOI
    10.1109/EduCon.2013.6530102
  • Filename
    6530102