• DocumentCode
    607155
  • Title

    Development of modular virtual lab for introductory computing courses

  • Author

    Branovic, I. ; Markovic, Dejan ; Popovic, R. ; Tomasevic, V. ; Zivkovic, D.

  • Author_Institution
    Dept. of Inf. & Comput., Singidunum Univ., Belgrade, Serbia
  • fYear
    2013
  • fDate
    13-15 March 2013
  • Firstpage
    1027
  • Lastpage
    1031
  • Abstract
    This paper describes the ongoing process of developing a virtual lab for different introductory computing courses based on the ACM-IEEE Computer Science Curricula. The laboratory is designed as a 3D virtual collaborative system with carefully developed instructional sequences covering different, often overlapping teaching subjects. The central object to every lab is a composite model of PC whose basic components are suitable for teaching computer architecture, programming, and operating systems courses. The same PC model is also used in conjunction with other composite 3D models of hardware for networking and net-centered courses. The 3D computing lab that we develop offers two advantages. First, composite component model it applies helps students gain a complete understanding of computing technology through interleaving problems viewed from different perspectives. Second, by following students´ activities and progress, instructors can easily identify the most difficult teaching concepts and modify their syllabi accordingly.
  • Keywords
    computer aided instruction; educational courses; groupware; teaching; virtual reality; 3D virtual collaborative system; ACM-IEEE Computer Science Curricula; computer architecture courses; introductory computing courses; modular virtual lab; operating systems courses; programming courses; teaching; Collaboration; Computational modeling; Computer science; Computers; Education; Solid modeling; Three-dimensional displays; 3D models; computing education; technology-enhanced learning; virtual lab;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Engineering Education Conference (EDUCON), 2013 IEEE
  • Conference_Location
    Berlin
  • ISSN
    2165-9559
  • Print_ISBN
    978-1-4673-6111-8
  • Electronic_ISBN
    2165-9559
  • Type

    conf

  • DOI
    10.1109/EduCon.2013.6530234
  • Filename
    6530234