DocumentCode :
608167
Title :
Influence of barrier design on current collapse in high voltage AlGaN/GaN HEMTs
Author :
Dasgupta, S. ; Biedermann, L. ; Sun, M. ; Kaplar, R.J. ; Marinella, Matthew J. ; Zavadil, K. ; Atcitty, S. ; Palacios, T.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fYear :
2013
fDate :
14-18 April 2013
Abstract :
Simultaneous measurements of surface potential and drain current detrapping transients in AlGaN/GaN HEMTs, performed on devices with two different epitaxial structures, show that the predominant location of charge trapping is affected more strongly by device design than by surface passivation or buffer defects. Experiments also show that AlGaN traps dominate current collapse in devices with thick AlGaN barrier layers.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; power HEMT; wide band gap semiconductors; AlGaN-GaN; barrier design influence; barrier layers; buffer defects; current collapse; drain current detrapping transients; high voltage HEMT; surface passivation; surface potential; Aluminum gallium nitride; Charge carrier processes; Electric fields; Gallium nitride; Logic gates; Stress; Surface topography; Galium Nitride; Kelvin Force Microscopy; Power HEMT; Trapping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2013.6531986
Filename :
6531986
Link To Document :
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