DocumentCode :
608179
Title :
Advances in industrial practices for optimal performance/reliability/power trade-off in commercial high-performance microprocessors for wireless applications
Author :
Huard, Vincent ; Cacho, F. ; Claramond, L. ; Alves, P. ; Dalkowski, W. ; Jacquet, D. ; Lecomte, S. ; Tan, Min ; Delemer, B. ; Kamoun, A. ; Fraisse, V.
Author_Institution :
STMicroelectron., Crolles, France
fYear :
2013
fDate :
14-18 April 2013
Abstract :
This paper deals with the challenge of optimizing the performance/reliability/power trade-off in commercial high-performance microprocessors for wireless applications in advanced CMOS nodes. Both the increased impact of electrical reliability degradation and an increased thermal runaway risk require a dedicated approach combining product engineering and high-level modeling approach to achieve optimal reliability guardband determination even in the case of numerous, discrete V-F operating modes and their related mission profiles.
Keywords :
CMOS integrated circuits; industrial engineering; microprocessor chips; radio networks; reliability; CMOS nodes; commercial high-performance microprocessors; discrete V-F operating modes; electrical reliability degradation; high-level modeling approach; industrial practices; optimal performance-reliability-power trade-off; optimal reliability guardband determination; product engineering; thermal runaway risk; wireless applications; Aging; Microprocessors; Phase locked loops; Program processors; Reliability engineering; Voltage measurement; AVS; DVFS; aged models; failure rate; gate-level models; guardband; microprocessor; product qualification; reliability; wireless application;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2013.6531998
Filename :
6531998
Link To Document :
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