Title :
A new formulation of breakdown model for high-к/SiO2 stack dielectrics
Author_Institution :
Semicond. R&D Center, Syst. & Technol. Group, IBM, Essex Junction, VT, USA
Abstract :
Unlike previously accepted notions, we present the experimental evidence that the first BD events (TBD) follows a single-Weibull distribution (2-parameters) for high-κ/SiO2 stack dielectrics using large-sample size experiments and fast-time measurements. It is found that neglecting the initial failure mode can lead to a false bending at low percentiles. In contrast, a bimodality with strong bending in residual time (TRES=TFAIL-TBD) distributions is commonly observed in all cases, suggesting a universal bimodal progressive BD (PBD) distribution which plays a fundamental role in circuit reliability. Using a general Monte Carlo simulator including the multiple-spot competing PBD mode with a 5-parameter model [1] for PBD distribution, we have obtained an excellent agreement by simultaneously fitting three distributions: TBD, TRES, and TFAIL(IFAIL), thus resolving a wide range of conflicting observations in recent publications in a coherent framework.
Keywords :
Monte Carlo methods; Weibull distribution; bending; circuit reliability; electric breakdown; failure analysis; high-k dielectric thin films; silicon compounds; 5-parameter model; BD events; Monte Carlo simulator; PBD distribution; SiO2; TBD; bending; breakdown model; circuit reliability; failure mode; fast-time measurements; high-κ dielectric stack; multiple-spot competing PBD mode; residual time distributions; single-Weibull distribution; universal bimodal progressive distribution; Current measurement; Dielectrics; Electric breakdown; Integrated circuit modeling; Logic gates; Stress; Time measurement;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2013.6532021