• DocumentCode
    60822
  • Title

    Electrical Analysis of High Dielectric Constant Insulator and Metal Gate Metal Oxide Semiconductor Capacitors on Flexible Bulk Mono-Crystalline Silicon

  • Author

    Ghoneim, Mohamed T. ; Rojas, Jhonathan P. ; Young, Chadwin D. ; Bersuker, Gennadi ; Hussain, Muhammad M.

  • Author_Institution
    Integrated Nanotechnol. Lab., King Abdullah Univ. of Sci. & Technol., Thuwal, Saudi Arabia
  • Volume
    64
  • Issue
    2
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    579
  • Lastpage
    585
  • Abstract
    We report on the electrical study of high dielectric constant insulator and metal gate metal oxide semiconductor capacitors (MOSCAPs) on a flexible ultra-thin (25 μm) silicon fabric which is peeled off using a CMOS compatible process from a standard bulk mono-crystalline silicon substrate. A lifetime projection is extracted using statistical analysis of the ramping voltage (Vramp) breakdown and time dependent dielectric breakdown data. The obtained flexible MOSCAPs operational voltages satisfying the 10 years lifetime benchmark are compared to those of the control MOSCAPs, which are not peeled off from the silicon wafer.
  • Keywords
    CMOS integrated circuits; MOS capacitors; elemental semiconductors; permittivity; semiconductor device breakdown; silicon; statistical analysis; CMOS compatible process; MOSCAP; bulk mono-crystalline silicon substrate; dielectric breakdown; dielectric constant insulator; electrical analysis; flexible bulk mono-crystalline silicon; lifetime projection; metal gate metal oxide semiconductor capacitors; ramping voltage breakdown; silicon wafer; size 25 mum; statistical analysis; Capacitance; Capacitance-voltage characteristics; Fabrics; Metals; Silicon; Stress; Voltage measurement; Flexible; Weibull distribution; lifetime projection; metal oxide semiconductor capacitors; time dependent dielectric breakdown; voltage breakdown;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.2014.2371054
  • Filename
    6967871