DocumentCode :
608265
Title :
Failure recovery mechanism caused by secondary defect
Author :
Karki, Suman ; Nguyen, Donald
Author_Institution :
DDAO, Texas Instrum. Inc., Dallas, TX, USA
fYear :
2013
fDate :
14-18 April 2013
Abstract :
This paper addresses how an observed secondary defect could be induced during the failure analysis and caused the original failure mode to be recovered. Two cases studies will be presented with the systematic approach of Failure analysis and successful attempt of finding the original failure defect while extrapolating the data at the time of failure recovery. Understanding the working of the circuitry in question is necessary to trace the original failure.
Keywords :
extrapolation; failure analysis; integrated circuit reliability; circuitry; data extrapolation; failure analysis; failure recovery mechanism; secondary defect; Capacitors; Circuit faults; Contacts; Failure analysis; Resistors; Scanning electron microscopy; Circuitry Analysis; Current Leakage; Current Mirrors; FIB Probe Pads; Fault Isolation; IC Failure Analysis; Micro-Probing; Mixed Signals; Nodal Probing; Original defect; Secondary defect; VREF circuitry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2013.6532084
Filename :
6532084
Link To Document :
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