Title :
Neutron-induced single-event-transient effects in ultrathin-body fully-depleted silicon-on-insulator MOSFETs
Author :
Jinshun Bi ; Reed, R.A. ; Schrimpf, R.D. ; Fleetwood, D.M. ; Zhengsheng Han
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
Abstract :
The neutron-induced single-event-transient (SET) response of 22-nm technology ultrathin-body fully-depleted silicon-on-insulator transistors is examined. Simulation results show that the impacts of ground plane doping and quantum effects on SETs are relatively small. The SET characteristics and collected charge are strike-location sensitive. The most SET-sensitive region in ultrathin-body fully-depleted SOI transistors is located near the drain region. The transient current peak is strongly affected by substrate bias. In contrast, the total collected charge depends only weakly on substrate bias. Circuits that are sensitive to total collected charge (e.g., SRAMs) may not be influenced by substrate bias, but substrate bias will impact the SET sensitivity of combinational logic.
Keywords :
MOSFET; combinational circuits; radiation hardening (electronics); semiconductor doping; silicon-on-insulator; SET characteristics; SET sensitivity; SET-sensitive region; Si; combinational logic; drain region; ground plane doping; neutron-induced single-event-transient effect; quantum effect; size 22 nm; substrate bias; transient current peak; ultrathin-body fully-depleted SOI transistor; ultrathin-body fully-depleted silicon-on-insulator MOSFET; ultrathin-body fully-depleted silicon-on-insulator transistor; Doping; Logic gates; Mathematical model; Neutrons; Silicon; Substrates; Transient analysis; collected charge; fully-depleted silicon-oninsulator; neutron; single-event-transient; ultrathin-body;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2013.6532109