• DocumentCode
    608709
  • Title

    Thermal management in hybrid silicon lasers

  • Author

    Sysak, M.N. ; Liang, D. ; Beausoleil, Raymond G. ; Jones, Roy ; Bowers, John E.

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    We review thermal management challenges in hybrid silicon lasers. Several technologies are discussed and experimentally verified to reduce device thermal impedance.
  • Keywords
    semiconductor lasers; thermal management (packaging); device thermal impedance reduction; hybrid silicon laser; thermal management; Heating; Impedance; Lasers; Metals; Silicon; Thermal management; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    978-1-4799-0457-0
  • Type

    conf

  • Filename
    6532849
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=608709