DocumentCode :
608709
Title :
Thermal management in hybrid silicon lasers
Author :
Sysak, M.N. ; Liang, D. ; Beausoleil, Raymond G. ; Jones, Roy ; Bowers, John E.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2013
fDate :
17-21 March 2013
Firstpage :
1
Lastpage :
3
Abstract :
We review thermal management challenges in hybrid silicon lasers. Several technologies are discussed and experimentally verified to reduce device thermal impedance.
Keywords :
semiconductor lasers; thermal management (packaging); device thermal impedance reduction; hybrid silicon laser; thermal management; Heating; Impedance; Lasers; Metals; Silicon; Thermal management; Waveguide lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0457-0
Type :
conf
Filename :
6532849
Link To Document :
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