DocumentCode :
609593
Title :
Research on ICT service energy impact assessment method: How much energy tomanufacture a chip
Author :
Schinella, S. ; Marquet, D. ; Le Masson, S. ; Tanaka, T. ; Chavanne, X. ; Frangi, J.P.
Author_Institution :
Orange Labs., Dept. Res. for Energy & Environ, France Telecom, Issy-les-Moulineaux, France
fYear :
2013
fDate :
22-24 April 2013
Firstpage :
1
Lastpage :
8
Abstract :
Telecommunications are expected to reduce the energetic impact of human society through dematerialization. But in addition to their utilization consumption, the ICT equipments are responsible of energy consumption for their fabrication. To assess as precisely as possible their consumption and the gain compared to physical services, we use a new modular and open method intended to reduce errors and highlight possible improvements. The lithography phase of chips manufactured from extrapure silicon wafers is responsible for about 70% of the consumption of chips fabrication. The main elements of this phase are the tools, which make the operations, and the air circuit, which cleans the air and control its levels of temperature and humidity 24h/24. This element is deeply analyzed in this paper, as a key module of the method which can be reused for other studies. Many parameters take part in the air circuit consumption, particularly the climate of the place where the factory is built, the class of the clean room and the amount of particles emitted. We try to put them ahead to understand this consumption and to know how to improve the energy efficiency.
Keywords :
energy conservation; humidity control; lithography; monolithic integrated circuits; power consumption; power supply circuits; silicon; temperature control; wafer level packaging; ICT equipment; ICT service energy impact assessment method; air circuit consumption; chip fabrication; energy utilization consumption; humidity level control; lithography; manufactured chip; silicon wafer; temperature level control; Computers; Equations; Humidity; Production facilities; Temperature control; Thyristors; ICT materials; chips fabrication; energy efficiency; life cycle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ITU Kaleidoscope: Building Sustainable Communities (K-2013), 2013 Proceedings of
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-4676-4
Type :
conf
Filename :
6533767
Link To Document :
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