DocumentCode
609653
Title
Microscopic degradation models for advanced technology
Author
Bersuker, Gennadi
Author_Institution
SEMATECH, Albany, NY, USA
fYear
2013
fDate
22-24 April 2013
Firstpage
1
Lastpage
1
Abstract
New failure mechanisms can be expected to emerge with introduction of new materials and device structures. Reliability assessment is further complicated by increasing device-to-device variability associated with continuous scaling that demands ever increasing sample sizes for statistical evaluations. To mitigate this trend, the traditional statistical reliability analysis can be complemented by the microscopic degradation models, which are based on the atomic-level material properties and explicitly consider defect generation caused by the carrier-dielectric interaction.
Keywords
failure analysis; reliability theory; statistical analysis; atomic-level material property; carrier-dielectric interaction; defect generation; device structures; device-to-device variability; failure mechanisms; microscopic degradation models; reliability assessment; statistical evaluations; statistical reliability analysis; Degradation; Dielectrics; Microscopy; Reliability; Stress; Temperature distribution; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium on
Conference_Location
Hsinchu
Print_ISBN
978-1-4673-4435-7
Type
conf
DOI
10.1109/VLDI-DAT.2013.6533829
Filename
6533829
Link To Document