• DocumentCode
    609653
  • Title

    Microscopic degradation models for advanced technology

  • Author

    Bersuker, Gennadi

  • Author_Institution
    SEMATECH, Albany, NY, USA
  • fYear
    2013
  • fDate
    22-24 April 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    New failure mechanisms can be expected to emerge with introduction of new materials and device structures. Reliability assessment is further complicated by increasing device-to-device variability associated with continuous scaling that demands ever increasing sample sizes for statistical evaluations. To mitigate this trend, the traditional statistical reliability analysis can be complemented by the microscopic degradation models, which are based on the atomic-level material properties and explicitly consider defect generation caused by the carrier-dielectric interaction.
  • Keywords
    failure analysis; reliability theory; statistical analysis; atomic-level material property; carrier-dielectric interaction; defect generation; device structures; device-to-device variability; failure mechanisms; microscopic degradation models; reliability assessment; statistical evaluations; statistical reliability analysis; Degradation; Dielectrics; Microscopy; Reliability; Stress; Temperature distribution; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-1-4673-4435-7
  • Type

    conf

  • DOI
    10.1109/VLDI-DAT.2013.6533829
  • Filename
    6533829