DocumentCode :
609779
Title :
Embedding thinned chips in flexible PCBs
Author :
Sterken, Tom ; Vermeiren, F. ; Tremlett, P. ; Christiaens, W. ; Vanfleteren, Jan
Author_Institution :
CMST (Affiliated with IMEC and Universiteit Gent), Technologiepark 914a, B-9052 Gent, Belgium
fYear :
2012
fDate :
17-20 Sept. 2012
Firstpage :
1
Lastpage :
4
Abstract :
Autonomous systems for healthcare and sports applications benefit largely from a small form factor, as minute dimensions result in maximal mobility and comfort. By embedding a commercially available IC in a flexible circuit board (FCB), the overall size of a system can be reduced. This work presents the process of thinning and packaging an IC in a flexible interposer, and the embedding thereof in a FCB. To illustrate the potential of this technology towards miniaturization, a commercially available RF transceiver ZL70102 was packaged and embedded, thus realizing a volume reduction of 60%.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
Type :
conf
DOI :
10.1109/ESTC.2012.6542087
Filename :
6542087
Link To Document :
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