Finite element modeling for reliability assessment of solder interconnections in a power transistor

In this study, the reliability modeling of solder interconnections in a power transistor with a compact metallic packaging is carried out. The finite element simulations are verified by experiments. Different loading conditions, thermal cycling (TC), drop impact, and vibration loadings, are considered in the present study. The micrographs from the failure analyses of the failed samples are also presented in order to show the location and detailed morphology of the cracks. The obtained results add insights into the correlation between different failure modes caused by various loading conditions and the stress state of the critical solder interconnections.