The thin package challenge

The relentless drive for miniaturization by mobile, electronic applications demands that the components follow suit. JEDEC describes the form factor for total component height including solder balls as XBGA when the height has been reduced to 0.5 mm. Several packaging solutions achieving this form factor will be introduced. In particular, a single sided substrate and concomitant package has been introduced which meets this form factor. Further, the manufacturing process has lead to the development of an entire product family of coreless substrates as well as embedded die/passives substrates. Process flows and reliability data will be discussed here in detail. Application samples will be shown.