DocumentCode
609820
Title
Plasma dicing technology
Author
Matsubara, Noriyuki ; Windemuth, Reinhard ; Mitsuru, Hiroshima ; Atsushi, Harikai
Author_Institution
Panasonic Factory Solutions Europe, A division of Panasonic Industries Devices Sales Europe GmbH, Winsbergring 15, D-22525 Hamburg, Germany
fYear
2012
fDate
17-20 Sept. 2012
Firstpage
1
Lastpage
5
Abstract
Conventional methods for wafer dicing like mechanical or laser dicing solution are showing some limitations. Plasma dicing process was designed to overcome such limitations regarding chip damage and throughput which is discussed in comparison with conventional dicing methods. Typical overall process flow is explained in detail. Some examples of etching results are shown. Solutions for round-corner-etching are explained. We will give better understanding of future solutions for dicing process by use of plasma.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location
Amsterdam, Netherlands
Print_ISBN
978-1-4673-4645-0
Type
conf
DOI
10.1109/ESTC.2012.6542178
Filename
6542178
Link To Document