Title :
New integration schemes for 2,5D interposer
Author :
Matthias, T. ; Wimplinger, M. ; Pauzenberger, G. ; Lindner, Philipp
Abstract :
2,5D interposer are a hot topic at the moment in the packaging world. An interposer allows to inter-chip communication between multiple chips with intra-chip interconnects. This enables unmatched bandwidth, reduced power consumption and very good heat spreading. The 2,5D interposer allows to implement a big part of the promise of 3D ICs without the need to make TSVs into the chips.
Keywords :
integrated circuit interconnections; integrated circuit packaging; integration; thermal management (packaging); three-dimensional integrated circuits; 2,5D interposer; 3D IC; TSV; heat spreading; integration scheme; inter-chip communication; intra-chip interconnects; packaging world; power consumption; unmatched bandwidth; Bandwidth; Compounds; Heat sinks; Manufacturing; Packaging; Power demand; Stacking;
Conference_Titel :
VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4673-3081-7
Electronic_ISBN :
978-1-4673-6422-5
DOI :
10.1109/VLSI-TSA.2013.6545616
