Title :
On-chip readout circuit for nanomagnetic logic
Author :
Baojun Liu ; Li Cai ; Jing Zhu ; Qiang Kang ; Mingliang Zhang ; Xiangye Chen
Author_Institution :
Sci. Coll., Air Force Eng. Univ., Xi´An, China
Abstract :
An interface for reading the output of nanomagnetic logic (NML) is indispensable in order for NML to interact with existing CMOS ICs. Two alternative designs readout interface circuit (RIC1 and RIC2) for NML RIC are proposed based on dual barriers magnetic tunnel junction (DBs-MTJ), which is composed of two fixed layers (with anti-parallel magnetisation state) and a common free layer. RIC1 utilises the same layer order of DB-MTJ to form an up-down structure, whereas RIC2 exploits the reversed layer order of DB-MTJ to form a left-right structure. They utilise the three-terminal approach to realise the self-reference readout scheme. The magnetisation state of the free layers in RIC1 and RIC2 are controlled by the fringing field from NML and biased by the designed on-chip clock field. The sensing circuits in RIC1 and RIC2 utilise dynamic current mode and pre-charge sense amplifier, respectively. The simulation results indicate that RIC1 and RIC2 can achieve comparable magnetoresistance values, and also realise the logical readout scheme by itself. The switching time in RIC1 is less than that in RIC2, whereas time delay for data transportation in RIC1 is more than that in RIC2. RIC2 is more amenable than RIC1 to the current fabrication process technology.
Keywords :
CMOS logic circuits; delays; magnetisation; magnetoresistance; nanomagnetics; preamplifiers; readout electronics; DB-MTJ; NML; NML RIC; RIC2; antiparallel magnetisation state; data transportation; dual barrier magnetic tunnel junction; dynamic current mode; fabrication process technology; fringing fleld; left-right structure; logical readout scheme; magnetisation state; magnetoresistance value; nanomagnetic logic; on-chip clock fleld; on-chip readout circuit; precharge sense amplifler; readout interface circuit; self-reference readout scheme; three-terminal approach; time delay; up-down structure;
Journal_Title :
Circuits, Devices & Systems, IET
DOI :
10.1049/iet-cds.2013.0113