DocumentCode :
610942
Title :
Reconfigurable computing in the era of post-silicon scaling [panel discussion]
Author :
Chung, Edward ; Burger, Danilo ; Butts, Mike ; Gray, Jordan ; Thacker, Chintan ; Vissers, Kees ; Wawrzynek, J.
Author_Institution :
Microsoft Research
fYear :
2013
fDate :
28-30 April 2013
Abstract :
Summary form only given, as follows. Although transistor densities continue to scale exponentially, the failure of Dennard Scaling prevents us from maximally utilizing die area in future power-constrained multicore processors-a phenomenon referred to as "Dark Silicon". Alternative energy-efficient architectures based on FPGAs, GPGPUs, ASICs, MPPAs, etc. are likely to continue on an exponential scaling trajectory while outperforming conventional architectures by an order-of-magnitude or more. With the impending threat of dark silicon, there is a critical window of opportunity for reconfigurable computing to become a mainstream ingredient and driver of future, scalable computer architectures. Before this can happen, major challenges and opportunities must be addressed: (1) how to gracefully integrate reconfigurable computing into existing software and hardware ecosystems, (2) how to build tools, languages, and compilers for agile application development and debugging, (3) how to identify and exploit emerging applications in datacenters and in energy-constrained form factors, (4) how to train and educate students and practitioners to use these systems in sustainable ways, and (5) how to define new and stable boundaries between software and hardware that make it easier to exploit reconfigurable computing. This panel brings together pioneers and experts in computer architecture and reconfigurable computing to discuss opportunities and challenges in the wake of dark silicon.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Field-Programmable Custom Computing Machines (FCCM), 2013 IEEE 21st Annual International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6005-0
Type :
conf
DOI :
10.1109/FCCM.2013.60
Filename :
6545985
Link To Document :
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