Title :
System in-Package solution with Dielectric Resonator Antenna and Power Amplifier for a 60 GHz high data-rate transmitter
Author :
Muhammad, S.A. ; Guzman, J.P. ; Ney, Michel ; Person, C. ; Pilard, Romain ; Kerherve, Eric ; Demirel, N.
Author_Institution :
Lab.-STICC, Telecom Bretagne, Brest, France
Abstract :
Performance of a System in-Package (SiP) module is evaluated in this paper. The solution consists of a Dielectric Resonator Antenna (DRA) excited by a Power Amplifier (PA). The impact of the bond wire and the closed proximity of the PA element have been considered in the simulation for the co-design of this highly integrated sub-system. Experimental results show a total EIRP of 21 dBm measured for the PA/DRA configuration.
Keywords :
dielectric resonator antennas; microwave antennas; microwave power amplifiers; system-on-package; DRA; PA; SiP module; bond wire; dielectric resonator antenna; frequency 60 GHz; high data-rate transmitter; power amplifier; system in-package solution; Antenna measurements; Dielectric resonator antennas; Gain; Resonant frequency; Wires; Dielectric resonator; System in Package; antenna;
Conference_Titel :
Antennas and Propagation (EuCAP), 2013 7th European Conference on
Conference_Location :
Gothenburg
Print_ISBN :
978-1-4673-2187-7
Electronic_ISBN :
978-88-907018-1-8
