DocumentCode :
612250
Title :
Message from the Advisory Committee Chair
Author :
Nakamura, T.
fYear :
2013
fDate :
17-19 April 2013
Abstract :
The goal of this conference is, as always, to be part of the premier conference series on microprocessor architecture and technology. This rapidly growing field regularly and aggressively produces innovative ideas and products that enable a transformation of the world around us day by day. Starting as an IEICE conference in 1998, today the COOL Chips conference series has become an internationally well-known conference series sponsored by the IEEE Computer Society in cooperation with IEICE Electron Device Society and IPSJ. COOL Chips is a sister conference to the HOT Chips held at Stanford University and HOT Interconnect conference held in California each August. We also invite you to attend these conference series. The relation between the COOL and HOT chips conferences is important as it spans geography and seasons.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Cool Chips XVI (COOL Chips), 2013 IEEE
Conference_Location :
Yokohama, Japan
Print_ISBN :
978-1-4673-5780-7
Electronic_ISBN :
978-1-4673-5781-4
Type :
conf
DOI :
10.1109/CoolChips.2013.6547907
Filename :
6547907
Link To Document :
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