• DocumentCode
    612265
  • Title

    Hardware support for resource partitioning in real-time embedded systems

  • Author

    Honmura, T. ; Kondoh, Yoshinori ; Yamada, Tomoaki ; Takada, Masumi ; Nitoh, T. ; Nojiri, T. ; Toyama, K. ; Saitoh, Youichi ; Nishi, Hidetaka ; Sato, Mitsuhisa ; Namiki, Mitaro

  • Author_Institution
    Central Res. Lab., Hitachi, Ltd., Kanagawa, Japan
  • fYear
    2013
  • fDate
    17-19 April 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Today´s embedded systems require multiple functions such as real-time control and information technology and integrating these functions on a multi-core processor is one effective solution. However, this increases overhead as it is necessary to partition resources in this approach to protect them. We developed hardware support called ExVisor/XVS to reduce the overhead of partitioning resources to achieve real-time characteristics. This features a physical address management module (PAM) that uses direct address translation by using a single level page table based on an embedded system´s memory usage. We evaluated the overhead in a virtual machine´s (VM) resource access through register transfer level (RTL) simulation and implementation on a field-programmable gate array (FPGA), and it was only less than 5.6% compared with the resource access time by a single core processor.
  • Keywords
    embedded systems; field programmable gate arrays; microprocessor chips; virtual machines; field-programmable gate array; hardware support; information technology; integrating these functions; multiple functions; physical address management module; real-time control; real-time embedded systems; resource partitioning; single core processor; single level page table; virtual machine; Embedded systems; Hardware; Memory management; Multicore processing; Random access memory; Real-time systems; Registers; ExVisor/XVS; PAM; Real-time; multi-core; resource partitioning; resource protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cool Chips XVI (COOL Chips), 2013 IEEE
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4673-5780-7
  • Electronic_ISBN
    978-1-4673-5781-4
  • Type

    conf

  • DOI
    10.1109/CoolChips.2013.6547922
  • Filename
    6547922