DocumentCode :
61314
Title :
Predictive Techniques for Projecting Test Data Volume Compression
Author :
Saeed, Samah Mohamed ; Sinanoglu, Ozgur ; Almukhaizim, S.
Author_Institution :
Comput. Sci. Dept., New York Univ. Polytech. Inst., New York, NY, USA
Volume :
21
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
1762
Lastpage :
1766
Abstract :
Test data compression is widely employed in scan design to tackle high test data volume (TDV) and test time problems. Given the number of scan-in pins available in automated test equipment, architectural decisions regarding the number of internal scan chains directly impact the compression level attained. While targeting an aggressive compression level by increasing the number of internal scan chains would reduce the TDV per encodable pattern, the cost of serially applying more patterns to restore the coverage loss offsets the compression benefits. Following up from our earlier work, we propose here a wide spectrum of predictive techniques for projecting the test cost of a given scan configuration for combinational xor-based decompression. The appropriate technique is selected by designers based on which stage the design is in, the design abstraction and the amount of information available, the permissible computational complexity of the techniques, and the accuracy of the projected optimal compression ratio.
Keywords :
automatic test equipment; combinational circuits; computational complexity; logic design; logic testing; losses; TDV; aggressive compression level; automated test equipment; combinational XOR-based decompression; computational complexity; coverage loss offset restoration; design abstraction; encodable pattern; internal scan chain; predictive technique; scan-in pin design; test data volume; test data volume compression; test time problem; Accuracy; Automatic test pattern generation; Circuit faults; Logic gates; Measurement; Probabilistic logic; Compression ratio; predictive techniques in test; scan-based testing; test data compression;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2012.2217359
Filename :
6338363
Link To Document :
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