DocumentCode :
61353
Title :
Micro-Masonry of MEMS Sensors and Actuators
Author :
Yong Zhang ; Hohyun Keum ; Kidong Park ; Bashir, Rumaan ; Seok Kim
Author_Institution :
Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Volume :
23
Issue :
2
fYear :
2014
fDate :
Apr-14
Firstpage :
308
Lastpage :
314
Abstract :
Micro-masonry is a route to microassembly that involves elastomeric-stamp-based micromanipulation and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators using micro-masonry, demonstrating its capability of constructing 3-D microdevices that are impossible or difficult to realize with monolithic microfabrication. Microfabrication processes for retrievable MEMS components (e.g., combs, spacers, and flexure beams) are developed. As micromanipulation tools, microtipped elastomeric stamps with reversible dry adhesion are also designed and fabricated to pick up and deterministically place those components. After the manipulation, the components are permanently bonded together via rapid thermal annealing without using any additional intermediate layers. The assembled MEMS device is modeled and analyzed in consideration of the microassembly misalignment. The sensing and actuating capabilities of the assembled MEMS devices are experimentally characterized.
Keywords :
bonding processes; elastomers; microactuators; microassembling; microfabrication; microsensors; rapid thermal annealing; 3D microdevices; MEMS actuators; MEMS mechanical sensor assembly; MEMS sensors; assembled MEMS device; direct bonding; elastomeric-stamp-based micromanipulation; microassembly misalignment; micromasonry process; microtipped elastomeric stamps; monolithic microfabrication; rapid thermal annealing; reversible dry adhesion; Assembly; Capacitance; Gold; Micromechanical devices; Resists; Silicon; Substrates; Microassembly; direct bonding; elastomeric stamps; micro-masonry; pick and place;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2013.2273439
Filename :
6570758
Link To Document :
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