• DocumentCode
    613595
  • Title

    Using data envelopment analysis for supplier evaluation with environmental considerations

  • Author

    Sun Zhe ; Wong, T.N. ; Lee, Loo Hay

  • Author_Institution
    Dept. of Ind. & Manuf. Syst. Eng., Univ. of Hong Kong, Hong Kong, China
  • fYear
    2013
  • fDate
    15-18 April 2013
  • Firstpage
    20
  • Lastpage
    24
  • Abstract
    With the proliferation of outsourcing in global market place, supplier selection has become a key strategic consideration in forming a competitive supply chain. Supplier selection has been recognized as a multi-criteria decision making problem in which suppliers are evaluated according to multiple criteria such as price, quality, delivery and service simultaneously. Facing with excessive pressures from government and customers, increasing number of companies are beginning to consider environmental issues in the procurement and supplier selection process to practice the sustainable development. It is therefore necessary to measure a supplier´s environmental performance. This paper aims to find out what kind of environmental criteria can be applied to assess suppliers overall performances. The multi-criteria decision making approach data envelopment analysis (DEA) is applied to help companies to evaluate suppliers´ various environmental performance and other capabilities simultaneously.
  • Keywords
    data envelopment analysis; decision making; supply chain management; sustainable development; DEA; competitive supply chain; data envelopment analysis; delivery criteria; environmental consideration; environmental issue; multicriteria decision making problem; price criteria; procurement process; quality criteria; service criteria; supplier environmental performance; supplier evaluation; supplier selection; sustainable development; Companies; Decision making; Europe; Green products; Solids; Supply chains; Training; DEA; Environmental Consideration; Supplier selection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems Conference (SysCon), 2013 IEEE International
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4673-3107-4
  • Type

    conf

  • DOI
    10.1109/SysCon.2013.6549852
  • Filename
    6549852