DocumentCode :
613595
Title :
Using data envelopment analysis for supplier evaluation with environmental considerations
Author :
Sun Zhe ; Wong, T.N. ; Lee, Loo Hay
Author_Institution :
Dept. of Ind. & Manuf. Syst. Eng., Univ. of Hong Kong, Hong Kong, China
fYear :
2013
fDate :
15-18 April 2013
Firstpage :
20
Lastpage :
24
Abstract :
With the proliferation of outsourcing in global market place, supplier selection has become a key strategic consideration in forming a competitive supply chain. Supplier selection has been recognized as a multi-criteria decision making problem in which suppliers are evaluated according to multiple criteria such as price, quality, delivery and service simultaneously. Facing with excessive pressures from government and customers, increasing number of companies are beginning to consider environmental issues in the procurement and supplier selection process to practice the sustainable development. It is therefore necessary to measure a supplier´s environmental performance. This paper aims to find out what kind of environmental criteria can be applied to assess suppliers overall performances. The multi-criteria decision making approach data envelopment analysis (DEA) is applied to help companies to evaluate suppliers´ various environmental performance and other capabilities simultaneously.
Keywords :
data envelopment analysis; decision making; supply chain management; sustainable development; DEA; competitive supply chain; data envelopment analysis; delivery criteria; environmental consideration; environmental issue; multicriteria decision making problem; price criteria; procurement process; quality criteria; service criteria; supplier environmental performance; supplier evaluation; supplier selection; sustainable development; Companies; Decision making; Europe; Green products; Solids; Supply chains; Training; DEA; Environmental Consideration; Supplier selection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems Conference (SysCon), 2013 IEEE International
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4673-3107-4
Type :
conf
DOI :
10.1109/SysCon.2013.6549852
Filename :
6549852
Link To Document :
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