• DocumentCode
    61389
  • Title

    Scaling Limits of Electrostatic Nanorelays

  • Author

    Pawashe, Chytra ; Lin, Kai-Chun ; Kuhn, Kelin J.

  • Author_Institution
    Design Technol. Solutions Group, Intel Corp., Hillsboro, OR, USA
  • Volume
    60
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    2936
  • Lastpage
    2942
  • Abstract
    A model to explore the scaling limits of electrostatically actuated nanorelays is presented, which shows that adhesion in a nanorelay´s contact interface limits its performance with respect to operating voltage, contact resistance, and switching energy. For logic applications, we show that an ultimately scaled relay can be more efficient than conventional metal-oxide-semiconductor devices if (1) it is designed with very high contact resistances, leading to ≈ 1-MHz operation due to large RC delays, or (2) its actuation area is extremely large compared with its contacting area, leading to very low voltage operation, which reduces overall CV2 losses. We propose new relay scaling relations that account for the scaling of contact interfaces.
  • Keywords
    contact resistance; microrelays; nanoelectromechanical devices; RC delay; actuation area; adhesion; contact interface scaling; contact resistance; electrostatic nanorelay; electrostatically actuated nanorelay; logic application; nanorelay contact interface; operating voltage; relay scaling relation; scaling limit; switching energy; Adhesives; Electrostatics; Force; Junctions; Nanoscale devices; Relays; Switches; Nanoelectromechanical systems (NEMS); relays;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2273217
  • Filename
    6570762