DocumentCode
614340
Title
Thermal condition monitoring of electrical installations based on infrared image analysis
Author
Jadin, Mohd Shawal ; Ghazali, Kamarul Hawari ; Taib, Soib
Author_Institution
Fac. of Electr. & Electron. Eng., Univ. Malaysia Pahang, Pekan, Malaysia
fYear
2013
fDate
27-30 April 2013
Firstpage
1
Lastpage
6
Abstract
Infrared imaging is a commonly used tool for monitoring and assessing the thermal condition of electrical installations for ensuring a reliable power supply. However, the conventional evaluation approach is quite time consuming as the image is analyzed manually by a qualified personnel. Therefore, this paper proposed a fast thermal anomaly detection and classification based on qualitative infrared image analysis. First, regions of interest (ROIs) are semi-automatically selected by employing normalized cross correlation (NCC) for finding similar objects in the image. Statistical features are extracted from each detected region and classified using multilayer perceptron (MLP) neural network for determining the thermal condition of electrical equipment. The overall accuracy obtained by the proposed method is approximately 95%, which is highly encouraging.
Keywords
condition monitoring; electrical installation; infrared imaging; multilayer perceptrons; neural nets; personnel; MLP; NCC; ROI; electrical equipment; electrical installations; infrared image analysis; multilayer perceptron; neural network; normalized cross correlation; personnel; power supply; regions of interest; statistical features; thermal anomaly classification; thermal anomaly detection; thermal condition monitoring; Accuracy; Feature extraction; Image segmentation; Reliability; Temperature measurement; Thermal analysis; Training; Infrared image; condition monitoring; image classification; object recognition; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Communications and Photonics Conference (SIECPC), 2013 Saudi International
Conference_Location
Fira
Print_ISBN
978-1-4673-6196-5
Electronic_ISBN
978-1-4673-6194-1
Type
conf
DOI
10.1109/SIECPC.2013.6550790
Filename
6550790
Link To Document