• DocumentCode
    614340
  • Title

    Thermal condition monitoring of electrical installations based on infrared image analysis

  • Author

    Jadin, Mohd Shawal ; Ghazali, Kamarul Hawari ; Taib, Soib

  • Author_Institution
    Fac. of Electr. & Electron. Eng., Univ. Malaysia Pahang, Pekan, Malaysia
  • fYear
    2013
  • fDate
    27-30 April 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Infrared imaging is a commonly used tool for monitoring and assessing the thermal condition of electrical installations for ensuring a reliable power supply. However, the conventional evaluation approach is quite time consuming as the image is analyzed manually by a qualified personnel. Therefore, this paper proposed a fast thermal anomaly detection and classification based on qualitative infrared image analysis. First, regions of interest (ROIs) are semi-automatically selected by employing normalized cross correlation (NCC) for finding similar objects in the image. Statistical features are extracted from each detected region and classified using multilayer perceptron (MLP) neural network for determining the thermal condition of electrical equipment. The overall accuracy obtained by the proposed method is approximately 95%, which is highly encouraging.
  • Keywords
    condition monitoring; electrical installation; infrared imaging; multilayer perceptrons; neural nets; personnel; MLP; NCC; ROI; electrical equipment; electrical installations; infrared image analysis; multilayer perceptron; neural network; normalized cross correlation; personnel; power supply; regions of interest; statistical features; thermal anomaly classification; thermal anomaly detection; thermal condition monitoring; Accuracy; Feature extraction; Image segmentation; Reliability; Temperature measurement; Thermal analysis; Training; Infrared image; condition monitoring; image classification; object recognition; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Communications and Photonics Conference (SIECPC), 2013 Saudi International
  • Conference_Location
    Fira
  • Print_ISBN
    978-1-4673-6196-5
  • Electronic_ISBN
    978-1-4673-6194-1
  • Type

    conf

  • DOI
    10.1109/SIECPC.2013.6550790
  • Filename
    6550790