DocumentCode :
614366
Title :
Electrical properties of Ag-silicon Schottky diode with orange-dye as interface layer deposited at various gravity accelerations
Author :
Moiz, Salman Abdul ; Nahhas, A.M. ; Karimov, Kh.S. ; Nasir, Haidawati ; Ahmed, M.M.
Author_Institution :
Fac. of Electr. Eng., Umm Al Qura Univ., Makkah, Saudi Arabia
fYear :
2013
fDate :
27-30 April 2013
Firstpage :
1
Lastpage :
5
Abstract :
In this study, it is presented that the quality of organic semiconductor thin film as interface layer can be optimized for efficient Schottky diode by using proper gravitational acceleration during centrifugal thin film deposition process. For this purpose, thin interfacial layer of orange dye (OD) was deposited at different gravity acceleration between Ag and n-Si substrates as Schottky diode by centrifugal deposition method. Different Schottky parameters such as series resistance, ideality factor and interface barrier height of Ag/OD/Si diodes were evaluated and compared as a function of gravity acceleration. It was observed that Schottky parameters were improved at higher gravity acceleration, but the most improved Schottky parameters were observed for Ag/OD/Si diode fabricated at 277g during centrifugal deposition process. Such improvement in barrier height and ideality factor at 277g can be attributed to the improved quality of OD thin film for Ag/Si Schottky diode.
Keywords :
Schottky diodes; organic semiconductors; silicon; silver; thin films; Ag-Si; Schottky diode electrical properties; Schottky parameters; barrier height; centrifugal thin film deposition process; gravity accelerations; ideality factor; interface layer; orange-dye; organic semiconductor thin film; Acceleration; Gravity; Resistance; Schottky diodes; Silicon; Sputtering; centrifugal thin film depostion; orange dye; organic semiconductor; schottky diode;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Communications and Photonics Conference (SIECPC), 2013 Saudi International
Conference_Location :
Fira
Print_ISBN :
978-1-4673-6196-5
Electronic_ISBN :
978-1-4673-6194-1
Type :
conf
DOI :
10.1109/SIECPC.2013.6550985
Filename :
6550985
Link To Document :
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