• DocumentCode
    614466
  • Title

    3D IC cooling mechanism by using signaling vias

  • Author

    Gevorgyan, Ara

  • Author_Institution
    Microelectron. Dept., SEUA, Yerevan, Armenia
  • fYear
    2013
  • fDate
    16-19 April 2013
  • Firstpage
    140
  • Lastpage
    143
  • Abstract
    In this paper is discussed the problem of efficient thermal energy removal in 3D integrated circuits (IC) based on thermal via insertion in parallel with using existing signaling vias. This method allows to minimize the number of additional thermal vias and by this save useful area of chip.
  • Keywords
    cooling; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; 3D integrated circuit cooling mechanism; signaling vias; thermal energy removal; thermal via insertion; Algorithm design and analysis; Conferences; Cooling; Integrated circuits; Routing; Thermal energy; Three-dimensional displays; 3D IC; convex hull; locus; thermal via;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference
  • Conference_Location
    Kiev
  • Print_ISBN
    978-1-4673-4669-6
  • Type

    conf

  • DOI
    10.1109/ELNANO.2013.6552044
  • Filename
    6552044
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=614466