Automated transmission electron microscopy for defect review and metrology of Si devices

Functions to automate TEM sample alignment and focus have been developed and tested on a 200 kV S/TEM. Sensitivity and repeatability data for functions allowing for automated eucentric height, focus, and zone axis alignment are presented. Eucentric and focus autofunctions were used to collect dynamic precision metrology data from a commercially available 22nm microprocessor. Results show 3σ standard deviation dynamic precision values better than 0.5nm for all recorded measurements.