The analysis of process queue time in a foundry environment

Author

Retersdorf, Michael ; Lederer, Ulf

Author_Institution

Manuf. Technol. - Yield Solutions Group, GLOBALFOUNDRIES, Malta, NY, USA

fYear

2013

fDate

14-16 May 2013

Firstpage

111

Lastpage

114

Abstract

This paper focuses on the mechanics and statistical techniques that are utilized to measure the impact of Qtime on a yield or parametric measurement on the wafers for a single specific process. It covers the techniques that have been utilized by GLOBALFOUNDRIES to identify all of the processes that may contribute to negative effects of product quality due to the effects of Qtime. These methodologies do not contain any complex mathematical techniques but the simple and intuitive approach to this analysis approach has been demonstrated to be very effective.

Keywords

foundries; product quality; queueing theory; semiconductor technology; statistical analysis; GLOBALFOUNDRIES; Qtime impact; complex mathematical technique; foundry environment; parametric measurement; process queue time analysis; product quality; single-specific process; statistical technique; Data mining; Data visualization; Foundries; Manufacturing; Queueing analysis; Sensitivity; data mining; etest; queue time; yield analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI

Conference_Location

Saratoga Springs, NY

ISSN

1078-8743

Print_ISBN

978-1-4673-5006-8

Type

conf

DOI

10.1109/ASMC.2013.6552785

Filename

6552785