Title :
Rough film wafer sensitivity improvement using light scattering inspection system
Author :
Chuanyong Huang ; Chu, Raymond ; Neskovic, Gordana
Author_Institution :
Surfscan Div., KLA-Tencor Corp, Milpitas, CA, USA
Abstract :
Improvements in the sensitivity of commercially available laser based surface scanning inspection systems can be achieved by adding an aperture to the optical path so that the rough film haze effect is spatially filtered. The current approach to optimizing the shape and dimensions of the aperture is time consuming and requires measurement equipment other than the laser based surface scanning inspection system for which the aperture is being optimized. The authors´ approach determines the optimal optical aperture using only haze and defect data collected directly on the inspection system. Two test wafers deposited with aluminum blanket films are used to demonstrate sensitivity improvements with designed optimal optical aperture. Aluminum blanket films are known to be rough films that generate significant background scatter, i.e. haze, that limits sensitivity by adversely impacting SNR. These wafers were taken from the deposition process for a key interconnect layer used in the back end of line (BEOL) fabrication of dynamic random access memory (DRAM) and logic devices. The proposed approach to optimizing optical apertures resulted in a 49% sensitivity improvement when detecting polystyrene latex (PSL) spheres deposited on one test wafer and a 32% increase in natural defect count on a second test wafer. In addition to the improvement in sensitivity, the optimized optical aperture enabled the differentiation of two more defect types: small particles and flakes.
Keywords :
DRAM chips; inspection; integrated circuit interconnections; integrated circuit testing; laser beam applications; logic devices; wafer level packaging; BEOL fabrication; DRAM; PSL spheres detection; SNR; aluminum blanket films; back end of line fabrication; background scatter; commercially available laser based surface scanning inspection systems; defect data; deposition process; dynamic random access memory; flake defect; key interconnect layer; light scattering inspection system; logic devices; measurement equipment; optical path; optimal optical aperture; particle defect; polystyrene latex sphere detection; rough film haze effect; rough film wafer sensitivity improvement; sensitivity improvements; shape optimization; wafer testing; Aluminum; Apertures; Optical films; Optical scattering; Optical sensors; Sensitivity; haze and defect scattering; laser based surface scanning inspection system; optimal optical aperture; rough film sensitivity; signal-to-noise ratio;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
Conference_Location :
Saratoga Springs, NY
Print_ISBN :
978-1-4673-5006-8
DOI :
10.1109/ASMC.2013.6552795