Energy-per-bit advantages of chip-scale hybrid-integrated optical interconnects using surface-normal electro-aborption MQW modulators

Author

Haney, Michael W. ; Tian Gu ; Venkataraman, Anupama P.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA

fYear

2013

fDate

5-8 May 2013

Firstpage

1

Lastpage

2

Abstract

A hybrid MQW/EAM-based chip-scale photonic interconnect concept is projected to achieve significantly lower energy-per-bit performance than monolithically integrated Si-Photonic and directly-modulated VCSEL approaches - enabling bandwidth density to scale with foreseeable high performance computing CMOS technology.

Keywords

CMOS integrated circuits; electro-optical modulation; elemental semiconductors; integrated optoelectronics; optical interconnections; semiconductor quantum wells; silicon; Si; bandwidth density; chip-scale hybrid-integrated optical interconnects; directly-modulated VCSEL approach; energy-per-bit advantages; high performance computing CMOS technology; hybrid MQW/EAM-based chip-scale photonic interconnect concept; monolithically integrated Si-photonic approach; surface-normal electro-aborption MQW modulators; Bandwidth; Couplers; Modulation; Optical interconnections; Optical waveguides; Photonics; Quantum well devices; Optical Interconnects; Photonic Integrated Circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Interconnects Conference, 2013 IEEE

Conference_Location

Santa Fe, NM

Print_ISBN

978-1-4673-5061-7

Electronic_ISBN

978-1-4673-5062-4

Type

conf

DOI

10.1109/OIC.2013.6552894

Filename

6552894