Title :
Energy-per-bit advantages of chip-scale hybrid-integrated optical interconnects using surface-normal electro-aborption MQW modulators
Author :
Haney, Michael W. ; Tian Gu ; Venkataraman, Anupama P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
A hybrid MQW/EAM-based chip-scale photonic interconnect concept is projected to achieve significantly lower energy-per-bit performance than monolithically integrated Si-Photonic and directly-modulated VCSEL approaches - enabling bandwidth density to scale with foreseeable high performance computing CMOS technology.
Keywords :
CMOS integrated circuits; electro-optical modulation; elemental semiconductors; integrated optoelectronics; optical interconnections; semiconductor quantum wells; silicon; Si; bandwidth density; chip-scale hybrid-integrated optical interconnects; directly-modulated VCSEL approach; energy-per-bit advantages; high performance computing CMOS technology; hybrid MQW/EAM-based chip-scale photonic interconnect concept; monolithically integrated Si-photonic approach; surface-normal electro-aborption MQW modulators; Bandwidth; Couplers; Modulation; Optical interconnections; Optical waveguides; Photonics; Quantum well devices; Optical Interconnects; Photonic Integrated Circuits;
Conference_Titel :
Optical Interconnects Conference, 2013 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4673-5061-7
Electronic_ISBN :
978-1-4673-5062-4
DOI :
10.1109/OIC.2013.6552894
