Title :
A compact 10×10 Gbps transmitter module based on a low cost 3D stacking solution
Author :
Raz, Oded ; Duan, Pinxiang ; Dorrestein, S. ; Williams, K.A. ; Molin, D. ; Sillard, P. ; Kraemer, F. ; Smalbrugge, B.E. ; Kuyt, G. ; Christensen, S.B. ; Lysdal, H. ; Duis, Jeroen ; Dorren, H.J.S.
Author_Institution :
TU/e, Eindhoven, Netherlands
Abstract :
We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.
Keywords :
integrated optics; optical interconnections; optical transmitters; surface emitting lasers; OM4-Plus fiber; bit rate 10 Gbit/s; distance 0 m; distance 500 m; sensitivity penalty; vertical cavity surface emitting lasers; CMOS integrated circuits; Error-free operations; Optical fiber communication; Optical transmitters; Receivers; Three-dimensional displays; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Interconnects Conference, 2013 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4673-5061-7
Electronic_ISBN :
978-1-4673-5062-4
DOI :
10.1109/OIC.2013.6552899
