Title :
Packaging technology for embedded optical modules
Author :
Ahadian, J. ; Kusumoto, K. ; Bachta, Paul ; Wong, Man ; Pommer, D. ; Hagan, R. ; Lenos, H. ; Kuznia, C.
Author_Institution :
Ultra Commun., Inc., Vista, CA, USA
Abstract :
We present packaging technology for creating compact, high-data rate fiber optic components that are compatible with high-temperature operation and solder reflow board assembly. We describe the application of this technology for mid-board optical communications.
Keywords :
optical communication; optical fibre fabrication; reflow soldering; high-data rate fiber optic components; optical communications; optical modules; packaging technology; solder reflow board assembly; Arrays; Flip-chip devices; Lenses; Optical fibers; Packaging; Transceivers;
Conference_Titel :
Optical Interconnects Conference, 2013 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4673-5061-7
Electronic_ISBN :
978-1-4673-5062-4
DOI :
10.1109/OIC.2013.6552901
