• DocumentCode
    615052
  • Title

    A fully-integrated flexible photonic platform for chip-to-chip optical interconnects

  • Author

    Juejun Hu ; Lan Li ; Hongtao Lin ; Yi Zou ; Tian Gu ; Haney, Mike

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Delaware, Newark, DE, USA
  • fYear
    2013
  • fDate
    5-8 May 2013
  • Firstpage
    128
  • Lastpage
    129
  • Abstract
    We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high integration density, low energy-per-bit, and does not require optical alignment during packaging.
  • Keywords
    integrated optics; optical interconnections; packaging; chip-to-chip optical interconnects; flexible substrate integration technology; integration density; optical alignment; packaging; Integrated circuit interconnections; Optical device fabrication; Optical fiber cables; Optical interconnections; Optical resonators; Optical surface waves; Optical waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Interconnects Conference, 2013 IEEE
  • Conference_Location
    Santa Fe, NM
  • Print_ISBN
    978-1-4673-5061-7
  • Electronic_ISBN
    978-1-4673-5062-4
  • Type

    conf

  • DOI
    10.1109/OIC.2013.6552959
  • Filename
    6552959
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=615052