• DocumentCode
    615271
  • Title

    The study of the standards architecture and the standards attributes based on EMC standards and TEMPEST standards in computer system

  • Author

    Zhang Jiemin ; Li Yongmei

  • Author_Institution
    Comput. Eng. Coll., Jimei Univ., Xiamen, China
  • fYear
    2013
  • fDate
    26-28 April 2013
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    Electromagnetic leakiness is so severe that reveal possibly the information contained in the signals with emissions. The standards on emission levels are classified into the EMC standards the TEMPEST standards. The paper discusses the standards architecture and the standards attributes based on the EMC standards and the TEMPEST standards in computer system. It presents the standards running at the same time should be serializability. The serializable standard means no conflicts on the specification of standards each other and so on. Every standard has a life cycle. It should be established and published on opportune moment. The architecture of standard exists so that can be named in nomenclature and demonstrated with systematical thinking approach. The research on the features of standards promotes the development of standards. The paper also reports the development of TEMPEST standards consistent with TEMPEST theories and products with analyzing of categorical data.
  • Keywords
    electromagnetic compatibility; electromagnetic waves; security of data; EMC standards; TEMPEST standards; categorical data analysis; computer system; electromagnetic leakiness; emission levels; serializability; serializable standard; standard architecture; standard attributes; standard specification; systematical thinking approach; Computers; Electromagnetic interference; Europe; Immunity testing; Industries; Standards; EMC; TEMPEST; architecture; conducted emissions; radiated emissions; standard;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science & Education (ICCSE), 2013 8th International Conference on
  • Conference_Location
    Colombo
  • Print_ISBN
    978-1-4673-4464-7
  • Type

    conf

  • DOI
    10.1109/ICCSE.2013.6553914
  • Filename
    6553914