Title : 
Novel subcarrier-pair based opportunistic DF protocol for cooperative downlink OFDMA
         
        
            Author : 
Wang, Tao ; Fang, Yong ; Vandendorpe, Luc
         
        
            Author_Institution : 
School of Communication & Information Engineering, Shanghai University, 200072, China
         
        
        
        
        
        
            Abstract : 
A novel subcarrier-pair based opportunistic DF protocol is proposed for cooperative downlink OFDMA transmission aided by a decode-and-forward (DF) relay. Specifically, user message bits are transmitted in two consecutive equal-duration time slots. A subcarrier in the first slot can be paired with a subcarrier in the second slot for the DF relay-aided transmission to a user. In particular, the source and the relay can transmit simultaneously to implement beamforming at the subcarrier in the second slot for the relay-aided transmission. Each unpaired subcarrier in either the first or second slot is used by the source for direct transmission to a user without the relay´s assistance. The sum rate maximized resource allocation (RA) problem is addressed for this protocol under a total power constraint. It is shown that the novel protocol leads to a maximum sum rate greater than or equal to that for a benchmark one, which does not allow the source to implement beamforming at the subcarrier in the second slot for the relay-aided transmission. Then, a polynomial-complexity RA algorithm is developed to find an (at least approximately) optimum resource allocation (i.e., source/relay power, subcarrier pairing and assignment to users) for either the proposed or benchmark protocol. Numerical experiments illustrate that the novel protocol can lead to a greater sum rate than the benchmark one.
         
        
            Keywords : 
Array signal processing; Benchmark testing; Downlink; OFDM; Protocols; Relays; Resource management;
         
        
        
        
            Conference_Titel : 
Wireless Communications and Networking Conference (WCNC), 2013 IEEE
         
        
            Conference_Location : 
Shanghai, Shanghai, China
         
        
        
            Print_ISBN : 
978-1-4673-5938-2
         
        
            Electronic_ISBN : 
1525-3511
         
        
        
            DOI : 
10.1109/WCNC.2013.6555089