Title :
Assessing regularity and variability of cortical folding patterns of dicccols
Author :
Jia Chen ; Jianfeng Lu ; Hanbo Chen ; Dajiang Zhu ; Tianming Liu
Author_Institution :
Sch. of Comput. Sci., Nanjing Univ. of Sci. & Technol., Nanjing, China
Abstract :
In our recent studies, we identified 358 common cortical landmarks named Dense Individualized and Common Connectivity-based Cortical Landmarks (DICCCOL), each of which possesses consistent fiber connection patterns across individuals and populations and is thus predictive of brain function. However, the regularity and variability of the cortical folding shape patterns of these DICCCOLs are unknown yet. This paper aims to employ statistical shape pattern descriptors based on the concept of visual words to quantitatively examine the folding shapes of DICCCOL landmarks. Our results demonstrated that the morphological cortical folding patterns are quite variable, but their regularity and variability are correlated with those of fiber connection patterns. This study suggests that cortical folding shape features might be complementary to connectivity-based features that can be jointly used for brain image registration and other human brain mapping applications.
Keywords :
biomedical MRI; computational linguistics; image registration; medical image processing; neurophysiology; pattern classification; statistical analysis; DICCCOL landmark folding shape; Dense Individualized and Common Connectivity based Cortical Landmarks; brain function prediction; brain image registration; cortical folding patterns; cortical folding shape pattern regularity; cortical folding shape pattern variability; cortical landmarks; fiber connection patterns; human brain mapping applications; regularity assessment; statistical shape pattern descriptors; variability assessment; visual words concept; Brain; Diffusion tensor imaging; Histograms; Indexes; Shape; Surface morphology; Vectors; DICCCOL; bag-of-words; cortical folding pattern; shape analysis;
Conference_Titel :
Biomedical Imaging (ISBI), 2013 IEEE 10th International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-6456-0
DOI :
10.1109/ISBI.2013.6556639