Title :
Fast and accurate multiscale electromagnetic modeling framework: An overview
Author :
Chew, W.C. ; Cangellaris, Andreas C. ; Schutt-Aine, Jose ; Braunisch, H. ; Qian, Z.G. ; Aydiner, A.A. ; Aygun, K. ; Jiang, Li Jun ; Ma, Z.H. ; Meng, Ling Ling ; Naeem, M.
Author_Institution :
Dept. Elec. Comp. Eng., U of Illinois Urbana-Champaign, Urbana, IL, USA
Abstract :
We present an overview of challenge problems in electromagnetic modeling of highly complex and multi-scale structures found in 3D IC, SiP, SoC, and electronic packaging necessary for signal integrity assessment.
Keywords :
integrated circuit modelling; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D IC; SiP; SoC; electronic packaging; highly-complex multiscale structures; multiscale electromagnetic modeling framework; signal integrity assessment; Electromagnetic modeling; Electromagnetics; Integral equations; Integrated circuit modeling; Mathematical model; Physics; 3D IC; SiP; SoP; accurate; electromagnetics; fast; modeling; multiscale; signal integrity;
Conference_Titel :
Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-5678-7
DOI :
10.1109/SaPIW.2013.6558315
