• DocumentCode
    618510
  • Title

    3D modeling in PCI Express Gen1 and Gen2 high-speed SI simulation

  • Author

    Runjing Zhou ; Jinsong Hu

  • Author_Institution
    Dept. of Autom., Inner Mongolia Univ., Hohhot, China
  • fYear
    2013
  • fDate
    12-15 May 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    PCI Express (PCIe) interface is widely used in current computer systems. In this paper, two 3D FEM modeling methodologies are introduced for the interested complex connector structure in the frequency domain. The PCIe Gen1 and Gen2 compliance measurement shows good agreement between simulation and measurement in the time domain. The study shows that 3D modeling is very important for PCIe Gen1 and Gen2 SI simulations.
  • Keywords
    finite element analysis; peripheral interfaces; solid modelling; 3D FEM modeling methodology; PCI express Gen1 high-speed SI simulation; PCI express Gen2 high-speed SI simulation; PCIe Gen1 compliance measurement; PCIe Gen2 compliance measurement; PCIe interface; complex connector structure; computer systems; frequency domain; time domain; Connectors; Field programmable gate arrays; Silicon; Solid modeling; Three-dimensional displays; Thumb; 3D FEM; PCIe Gen1; PCIe Gen2; SI simulation; compliance measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-5678-7
  • Type

    conf

  • DOI
    10.1109/SaPIW.2013.6558321
  • Filename
    6558321
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=618510